XRF for PCBs and Microstructures – FISCHERSCOPE XDV-µ

XRF for Microstructures and PCBs

In electronics and semiconductor manufacturing, coatings are measured on very small areas: tracks, contacts, SMD components, lead frames. Helmut Fischer FISCHERSCOPE XDV-µ instruments with polycapillary optics focus the X-ray beam onto a very small spot. The XDV-µ PCB XL is designed for large printed circuit boards (ENIG, ENEPIG, immersion Ag and Sn), and the XDV-µ SEMI for automated inspection of semiconductor wafers.

Helmut Fischer FISCHERSCOPE X-RAY XDV-µ series – microstructure measurement with polycapillary optics

For the electronics and semiconductor industry – for measuring conductor tracks, contacts, lead frames, SMD components, thin wires and complex multilayer systems, and the phosphorus content of electroless nickel layers under gold and palladium (ENIG/ENEPIG).

Helmut Fischer FISCHERSCOPE XDV-µ PCB XL – coating inspection of printed circuit boards

For PCB manufacturers and EMS companies inspecting thin final finishes (ENIG, ENEPIG, immersion Ag and Sn) on large boards.

Helmut Fischer FISCHERSCOPE X-RAY XDV-µ SEMI – automated wafer microstructure inspection

For semiconductor manufacturing and packaging (2.5D/3D) – inspection of nanometre-scale under-bump metallisation (UBM), C4 and smaller solder bumps, and lead-free solder caps on copper pillars.