Helmut Fischer FISCHERSCOPE X-RAY XDV-µ SEMI – automated wafer microstructure inspection

Applications

For semiconductor manufacturing and packaging (2.5D/3D) – inspection of nanometre-scale under-bump metallisation (UBM), C4 and smaller solder bumps, and lead-free solder caps on copper pillars. The enclosed measuring environment ensures constant conditions; the instrument is suitable for cleanrooms and 24/7 operation.

Key features

• Fully automated wafer loading from FOUPs and cassettes; compatible with OHT and AGV supply
• Integrated CCTV monitoring, large service hatches
• Polycapillary optics with 10 or 20 µm FWHM measuring spots
• DPP+ – up to 50 % higher performance
• Programmable measurements based on pattern recognition
• Standardised SECS/GEM communication

Models

detector (20 / 50 mm²) and spot (10 / 20 µm) options

Technical data

• Wafers: 6, 8 and 12 in. (up to 12 in.)
• X-ray tube: “Ultra” microfocus, tungsten anode
• Detector: SDD 20 or 50 mm², Peltier cooling
• Measuring spot: 10 or 20 µm (FWHM)
• Filters: 4 interchangeable
• Stage: programmable, with vacuum wafer chuck
• Communication: SECS/GEM
• Software: WinFTM

What we offer

• Selection of the instrument and configuration for your task, together with the manufacturer
• Trial measurements of your samples in the manufacturer’s laboratory
• Training, calibration and service organised through the manufacturer

Request a quote

Technical data according to the manufacturer: helmut-fischer.com