Helmut Fischer FISCHERSCOPE X-RAY XULM / XUL – entry-level coating thickness gauge

Applications

For electroplating companies and electronics manufacturing that need fast and accurate measurement of coating thickness on small parts and of metal content in electroplating baths. Measuring from bottom to top allows large flat samples (PCBs, flexible boards) to be positioned quickly.

Key features

  • Largest measuring window on the market (proportional counter detector) – short measuring time
  • Hood with C-shaped slot for large flat samples
  • Microfocus tube, smallest measuring spot approx. Ø 0.1 mm
  • Live image of the measuring spot
  • Quick start-up, optimal cost-benefit ratio
  • Fully protected, type-approved instrument

Models

XUL; XULM

Technical data

  • Detector: proportional counter
  • X-ray tube: microfocus
  • Sample height: up to 170 mm
  • Smallest measuring spot: approx. Ø 0.1 mm
  • Apertures: fixed or 4 interchangeable
  • Filters: fixed or 3 interchangeable
  • Software: WinFTM

What we offer

  • Selection of the instrument and configuration for your task, together with the manufacturer
  • Trial measurements of your samples in the manufacturer’s laboratory
  • Training, calibration and service organised through the manufacturer

Request a quote

Technical data according to the manufacturer: helmut-fischer.com

You might also be interested in

Helmut Fischer FISCHERSCOPE X-RAY XAN – universal metal and alloy analyzer

For trade, industry and laboratories: determining the composition of gold and silver alloys, analysing dental alloys, measuring coating thickness on simply shaped samples, screening for hazardous substances (e.g. lead in toys) according to RoHS.

Helmut Fischer FISCHERSCOPE X-RAY XDL / XDLM – serial inspection of electroplated coatings

For the electroplating, aviation and sanitary fittings industries – for quality control of mass-produced parts, incoming goods inspection and production monitoring.

Helmut Fischer FISCHERSCOPE XDAL – new-generation thin coating analyzer

For electronics and semiconductor manufacturing (lead frames, connectors, PCBs), for inspecting multilayer systems and functional coatings ≤ 0.1 µm, and for determining the lead content in solders and the phosphorus content in NiP coatings.

Helmut Fischer FISCHERSCOPE XDV – top-of-the-range universal XRF instrument

For laboratories and production where extremely thin and complex coatings are measured (Au/Pd ≤ 50 nm, gold from 2 nm on lead frames, coatings on silicon wafers), light elements (Al, Ti, NiP) and fuel cell and battery foils (Pt, Ir, Ce; Ni, Co, Mn) are analysed, and gold analysis to the highest requirements is carried out.